Samsung Electronics
7 chips available
LPDDR4-200-2N-DB
Memory
LPDDR4 SDRAM, 200-ball Fine Ball Grid Array package, 2Gb density
Package Type: FBGA-200
LPDDR4-200-2N-DB-3
Memory
LPDDR4-200 is a low-power double data rate 4 (LPDDR4) synchronous DRAM (SDRAM) chip with a data transfer rate of 2000 Megabits per second (Mbps); '2N' signifies a 256 Megabit (Mb) chip size; 'DB' indicates a Ball Grid Array (BGA) package.
Package Type: BGA
LPDDR4X-X200-1
Memory
LPDDR4X DRAM chip with a data rate of up to 2000MT/s
Package Type: LGA (Land Grid Array)
LPDDR4X-X200-3
Memory
LPDDR4X memory chip model with data rate up to 2000MT/s
Package Type: LCGA (Land Grid Array)
SA555
Microcontroller
SA555 is a high-performance 16-bit microcontroller with built-in flash memory and EEPROM.
Package Type: SOIC-14
SAMSUNG LPDDR4X-X210-1
Memory
SAMSUNG LPDDR4X-X210-1 is a 16Gb LPDDR4X DRAM chip with a transfer rate of up to 3733Mbps.
Package Type: LGA (Land Grid Array)
SAMSUNG LPDDR5
Memory
SAMSUNG LPDDR5 is a high-performance, low-power, dual-channel, 16Gb LPDDR5 DRAM, designed for mobile and computing applications.
Package Type: Flip Chip Ball Grid Array (FCBGA)